[2018]
Ultrahigh Conductivity and Superior Interfacial Adhesion of a Nanostructured, Photonic Sintered Copper Membrane for Printed Flexible Hybrid Electronics
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2019.01.09 16:50
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저널명 : ACS Applied Materials & Interfaces Vol.10, Issue50, pp44071~44079
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- 관련링크 : http://10.1021/acsami.8b17164943회 연결
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