[2012]
Adhesion Enhancement of Ink-Jet Printed Conductive Copper Patterns on a Flexible Substrate
최고관리자
2018.07.11 16:41
1,164
0
:
저널명 : Journal of Materials Chemistry, 22 (2012), p12517-22
-
- 관련링크 : http://dx.doi.org/10.1039/C2JM31381B1310회 연결
댓글목록 0