Conference

[2009] Improvement of Adhesion Property for Copper Patterns on Polyimide Subs…

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2018.07.17 14:31 1,191 0
Conference Name : International Conference on Flexible and Printed Electronics 2009(ICFPE)

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Improvement of Adhesion Property for Copper Patterns on Polyimide Substrate by Silane-Coupling Reaction            

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